日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications

三维塑料电路载体的组装和互连技术:技术、材料和应用概述

Werum, Kai; Eberhardt, Wolfgang; Reenaers, Dieter; Mager, Thomas; Endl, Mika; Zimmermann, André; Deferme, Wim

A Silicon Rhodamine-fused Glibenclamide to Label and Detect Malaria-infected Red Blood Cells

一种硅罗丹明融合的格列本脲用于标记和检测疟疾感染的红细胞

Bastl, Claudia; Close, Cindy M; Holtz, Ingo; Gatin-Fraudet, Blaise; Eis, Mareike; Werum, Michelle; Konrad, Smilla; Kneller, Laura; Roßmann, Kilian; Huhn, Christiane; Ghosh, Souvik; Ast, Julia; Roosen, Dorien A; Lehmann, Martin; Haucke, Volker; Reymond, Luc; Hodson, David J; Tinnefeld, Philip; Johnsson, Kai; Glembockyte, Viktorija; Kilian, Nicole; Broichhagen, Johannes

Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications

PEEK/PEI共混物作为高频电路板基材的介电性能

Scherzer, Tim; Wolf, Marius; Werum, Kai; Ruckdäschel, Holger; Eberhardt, Wolfgang; Zimmermann, André

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane

基于PCB的压力传感器的特性分析及其金属膜片连接方法

Schwenck, Adrian; Grözinger, Tobias; Günther, Thomas; Schumacher, Axel; Schuhmacher, Dietmar; Werum, Kai; Zimmermann, André