Integrating planar photonics for multi-beam generation and atomic clock packaging on chip
将平面光子学技术集成到芯片上,用于多光束生成和原子钟封装。
期刊:Light-Science & Applications
影响因子:23.4
doi:10.1038/s41377-023-01081-x
Ropp, Chad; Zhu, Wenqi; Yulaev, Alexander; Westly, Daron; Simelgor, Gregory; Rakholia, Akash; Lunden, William; Sheredy, Dan; Boyd, Martin M; Papp, Scott; Agrawal, Amit; Aksyuk, Vladimir