Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact
跌落冲击下3D芯片互连微凸点连接处裂纹失效特征
期刊:Micromachines
影响因子:3
doi:10.3390/mi13020281
Liu, Zhen; Fang, Mingang; Shi, Lei; Gu, Yu; Chen, Zhuo; Zhu, Whenhui
