Multifunctional Polyimide for Packaging and Thermal Management of Electronics: Design, Synthesis, Molecular Structure, and Composite Engineering
用于电子产品封装和热管理的多功能聚酰亚胺：设计、合成、分子结构和复合材料工程
期刊:Nanomaterials
影响因子:4.3
doi:10.3390/nano15151148
Chen, Xi; Fu, Xin; Chen, Zhansheng; Zhai, Zaiteng; Miu, Hongkang; Tao, Peng
