A Selective Deposition Strategy of Ultrathin Metal Layer on Sub-Micrometer-Pitch Cu Interconnection for Low-Temperature Hybrid Bonding
一种用于低温混合键合的亚微米间距铜互连超薄金属层选择性沉积策略
期刊:Small Science
影响因子:8.3
doi:10.1002/smsc.202500271
Otgonbayar, Zambaga; Noh, Jungchul; Yoon, Seong-Ho; Park, Gyu-Sik; Jekal, Suk; Kim, Jiwon; Lee, Jeong-Hwan; Choi, Rino; Kim, Jeonghun; Kim, Myeongjin; Yoon, Chang-Min