Abstract
The global rise in electronic waste is alarming, driven by the persistent use of glass, epoxy, and plastic substrates owing to their cost, stability, flexibility, and transparency. This underscores the need for biodegradable alternatives with similar properties. This study shows that leaf-derived lignocellulose scaffolds can stabilize bio-sourced, solution-processed polymers by acting as natural sequestering media. Such reinforced films, even when based on gelatin (T(g) ~ 60°C), can endure processes over 200°C. We demonstrate dip-coated ethyl cellulose films for commercially viable reflow soldered circuitry. The films offer high flexibility, more than 80% transparency, and surface roughness below 5.5 nm. Advanced OPDs and OECTs fabricated on these films perform comparably to those on glass and the low material cost and simple fabrication process yields a minimal carbon footprint of 1.6 kgCO(2)/m(2). This work thus opens a vista of possibilities for biodegradable polymers heretofore considered unsuitable for making temperature-stable substrates for state-of-the-art electronics applications.