Abstract
Splitting a large contact area into finer, sub-contact areas is thought to result in higher adaptability to rough surfaces, stronger adhesion, and a more uniform stress distribution with higher tolerance to defects. However, while it is widely believed that contact splitting helps to mitigate the negative effects of roughness on adhesion- and friction-based attachment, no decisive experimental validation of this hypothesis has been performed so far for thin-film-based adhesives. To this end, we report on the behavior of original and split, wall-shaped adhesive microstructures on different surfaces ranging across four orders of magnitude in roughness. Our results clearly demonstrate that the adhesion- and friction-driven attachment of the wall-shaped microstructure degrades, regardless of the surface waviness, when the surface roughness increases. Second, splitting the wall-shaped microstructure indeed helps to mitigate the negative effect of the increasing surface unevenness by allowing the split microstructure to adapt more easily to the surface waviness and by reducing the effective average peeling angle. These findings can be used to guide the development of biomimetic shear-actuated adhesives suitable for operation not only on smooth but also on rough surfaces.