Abstract
A nano-sized silver-coated tin (Sn@Ag) slurry was prepared by heterogeneous flocculation method by adjusting the pH value of solution and selecting different dispersants. The slurry improved the oxidation resistance of tin and its dispersibility in silver matrix. The sintering strength of nanometre Sn@Ag slurry increases with the increase of Sn content. When the Sn content reaches 5%, the shear strength of the joint reaches the highest 50 MPa, which is more than 10 MPa higher than that of the pure nanometre silver slurry sintered joint. The increase of shear strength is due to the fact that the equilibrium phase formed after sintering is Ag-Sn replacement solid solution and intermetallic compound Ag(3)Sn, which have the effect of replacement solution strengthening and dispersion strengthening, respectively. It is proved by experiments and analysis that the application of nano-silver paste in chip interconnection is feasible. The research of this subject provides experimental reference and theoretical basis for the application of new generation interconnect materials in power devices and promotes the development of microelectronics packaging technology.