Abstract
Cracks have a primary effect on the failure of a structure. Therefore, the development of crack sensors with high accuracy and resolution and cracks detection method are important. In this study, the crack sensors were fabricated, and the crack locations were detected with the electrical signal of the crack sensor. First, a metal grid-type micro-crack sensor based on silver was fabricated. The sensor is made with electrohydrodynamics (EHD) inkjet printing technology, which is well known as the next generation of printed electronics technology. Optimal printing conditions were established through experiments, and a grid sensor was obtained. After that, single cracks and multiple cracks were simulated on the sensor, and electrical signals generated from the sensor were measured. The measured electrical signal tracked the location of the cracks in three steps: simple cross-calculation, interpolation, and modified P-SPICE. It was confirmed that cracks could be effectively found and displayed using the method presented in this paper.