Silicon-on-Insulator (SOI) Lateral Power-Reduced Surface Field FinFET with High-Power Figure of Merit of 239.3 MW/cm(2)

绝缘体上硅(SOI)横向功率降低表面场FinFET,功率品质因数高达239.3 MW/cm(2)

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Abstract

In this study, we propose a lateral power-reduced surface field FinFET (LPR-FinFET) to achieve high breakdown voltage and low on-resistance. We investigate the electric field distribution within the reduced surface field (RESURF) structure under reverse-biased conditions, as well as forward transfer and output characteristics using TCAD simulation. The proposed LPR-FinFET demonstrates a high breakdown voltage of 247 V and a low specific on-resistance of 0.255 mΩ·cm(2) with a high-power figure of merit of 239.3 MW/cm(2). The superior characteristics of our proposed LPR-FinFET show the potential for applications as a lateral power semiconductor using silicon-on-insulator (SOI) technology.

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