Abstract
We report a catalytic cleaning method for aluminum-based ceramic substrates, including aluminum nitride (AlN) and alumina (Al(2)O(3)), to enhance the performance of high-frequency, low-noise electronic devices. These ceramic materials are widely used in high-power and RF electronics due to their excellent thermal and insulating properties. However, conventional surface processing techniques, such as laser micromachining and diamond polishing, often introduce carbon-based impurities and defects, particularly in thin substrates (<100 μm), that degrade device performance by increasing dielectric loss. Using X-ray photoelectron spectroscopy (XPS), we confirmed the presence of aluminum carbide (AlC) and other surface contaminants on untreated AlN substrates. The proposed catalytic cleaning method, conducted in a hydrogen-rich atmosphere, effectively removes these impurities and restores surface integrity. Comparative analysis of cleaned and uncleaned samples revealed a substantial reduction in dielectric loss following treatment. This improvement in surface quality directly enhances the performance of devices operating at radio frequencies (RF) and microwave frequencies. It is especially valuable for applications in quantum electronics, where low noise and high interface quality are critical. Our findings provide a practical and scalable approach to optimizing ceramic substrate surfaces, contributing to the development of more reliable and efficient next-generation electronic systems.