Abstract
In this paper, we review the current development of stencil lithography for scalable micro- and nanomanufacturing as a resistless and reusable patterning technique. We first introduce the motivation and advantages of stencil lithography for large-area micro- and nanopatterning. Then we review the progress of using rigid membranes such as SiNx and Si as stencil masks as well as stacking layers. We also review the current use of flexible membranes including a compliant SiNx membrane with springs, polyimide film, polydimethylsiloxane (PDMS) layer, and photoresist-based membranes as stencil lithography masks to address problems such as blurring and non-planar surface patterning. Moreover, we discuss the dynamic stencil lithography technique, which significantly improves the patterning throughput and speed by moving the stencil over the target substrate during deposition. Lastly, we discuss the future advancement of stencil lithography for a resistless, reusable, scalable, and programmable nanolithography method.