Abstract
Chip defect detection is a crucial aspect of the semiconductor production industry, given its significant impact on chip performance. This paper proposes a lightweight neural network with dual decoding paths for LED chip segmentation, named LDDP-Net. Within the LDDP-Net framework, the receptive field of the MobileNetv3 backbone is modified to mitigate information loss. In addition, dual decoding paths consisting of a coarse decoding path and a fine-grained decoding path in parallel are developed. Specifically, the former employs a straightforward upsampling approach, emphasizing macro information. The latter is more detail-oriented, using multiple pooling and convolution techniques to focus on fine-grained information after deconvolution. Moreover, the integration of intermediate-layer features into the upsampling operation enhances boundary segmentation. Experimental results demonstrate that LDDP-Net achieves an mIoU (mean Intersection over Union) of 90.29% on the chip dataset, with parameter numbers and FLOPs (Floating Point Operations) of 2.98 M and 2.24 G, respectively. Comparative analyses with advanced methods reveal varying degrees of improvement, affirming the effectiveness of the proposed method.