PCB Electronic Component Soldering Defect Detection Using YOLO11 Improved by Retention Block and Neck Structure

基于YOLO11的PCB电子元件焊接缺陷检测方法,通过加固块和颈部结构得到改进。

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Abstract

Printed circuit board (PCB) assembly, on the basis of surface mount electronic component welding, is one of the most important electronic assembly processes, and its defect detection is also an important part of industrial generation. The traditional two-stage target detection algorithm model has a large number of parameters and the runtime is too long. The single-stage target detection algorithm has a faster running time, but the detection accuracy needs to be improved. To solve this problem, we innovated and modified the YOLO11n model. Firstly, we used the Retention Block (RetBlock) to improve the C3K2 module in the backbone, creating the RetC3K2 module, which makes up for the limitation of the original module's limited, purely convolutional local receptive field. Secondly, the neck structure of the original model network is fused with a Multi-Branch Auxiliary Feature Pyramid Network (MAFPN) structure and turned into a multi-branch auxiliary neck network, which enhances the model's ability to fuse multiple scaled characteristics and conveys diverse information about the gradient for the output layer. The improved YOLO11n model improves its mAP50 by 0.023 (2.5%) and mAP75 by 0.026 (2.8%) in comparison with the primitive model network, and detection precision is significantly improved, proving the superiority of our proposed approach.

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