Abstract
The ability to configure the optimal buffer layer for GaN growth depends on the knowledge of relaxation processes that occurs during the cooling step while countering the tensile stresses due to the contrast of thermal expansion coefficient between GaN and Si(111) substrate. Here, we inaugurate the pulse atomic-layer epitaxy (PALE) AlN layer to reinforce the buffer layer to achieve a thick GaN epilayer which is crucial for high performance power devices. The characteristics of grown GaN on Si substrate based on PALE AlN thickness of 0 ~ 100 nm are investigated along with microstructural evolution between AlN NL and composition-graded AlGaN buffer layer. PALE AlN layer deposited with an optimum thickness of 50 nm and above was observed to exhibit a highly uniform coalesced GaN epilayer surface with root-mean square (RMS) roughness of 0.512 nm. The thickness of the PALE AlN layer substantially affected the crystallinity of the top GaN epilayer where the lowest value for symmetric (0 0 0 2) and asymmetric (1 0 -1 2) x-ray rocking curve analysis were achieved, indicating the reduction of threading dislocation density in the growth structure. Transition of the E(2) (high) peak from the Raman spectrum shows that the strain compression in GaN epilayer is directly proportional to the thickness of the PALE AlN layer.