Abstract
This paper presents a very low-profile on-ground chip antenna with a total volume of 0.075λ0× 0.056λ0× 0.019λ0 (at f0 = 2.4 GHz). The proposed design is a corrugated (accordion-like) planar inverted F antenna (PIFA) embedded in low-loss glass ceramic material (DuPont GreenTape 9k7 with ϵr = 7.1 and tanδ = 0.0009) fabricated with LTCC technology. The antenna does not require a clearance area on the ground plane where the antenna is located, and it is proposed for 2.4 GHz IoT applications for extreme size-limited devices. It shows a 25 MHz impedance bandwidth (for S11 < -6 dB), which means a relative bandwidth of 1%). A study in terms of matching and total efficiency is performed for several size ground planes with the antenna installed at different positions. The use of characteristic modes analysis (CMA) and the correlation between modal and total radiated fields is performed to demonstrate the optimum position of the antenna. Results show high-frequency stability and a total efficiency difference of up to 5.3 dB if the antenna is not placed at the optimum position.