Abstract
As microelectronics technology advances towards miniaturization and higher integration, the imperative for developing high-performance thermal management materials has escalated. Thermal conductive polymer composites (TCPCs), which leverage the benefits of polymer matrices and the unique effects of nano-enhancers, are gaining focus as solutions to overheating due to their low density, ease of processing, and cost-effectiveness. However, these materials often face challenges such as thermal conductivities that are lower than expected, limiting their application in high-performance electronic devices. Despite these issues, TCPCs continue to demonstrate broad potential across various industrial sectors. This review comprehensively presents the progress in this field, detailing the mechanisms of thermal conductivity (TC) in these composites and discussing factors that influence thermal performance, such as the intrinsic properties of polymers, interfacial thermal resistance, and the thermal properties of fillers. Additionally, it categorizes and summarizes methods to enhance the TC of polymer composites. The review also highlights the applications of these materials in emerging areas such as flexible electronic devices, personal thermal management, and aerospace. Ultimately, by analyzing current challenges and opportunities, this review provides clear directions for future research and development.