Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study
铜金属化玻璃通孔的长期高温老化机制:纳米压痕测试与混合 Potts 相场模拟相结合的研究
期刊:Microsystems & Nanoengineering
影响因子:9.9
doi:10.1038/s41378-026-01160-0
Chen, Junwei; Li, Zezhan; Yang, Bin; Hu, Xiao; Li, Wenyu; Li, Zichuan; Yan, Xuyang; Yang, Zhoudong; Liang, Jiao; Yang, Guannan; Gu, Chao; Zheng, Changran; Cui, Chengqiang; Zhang, Guoqi; Fan, Jiajie