日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Tailoring Hydrogenation to Enhance Defect Suppression and Charge Transport in Hydrogenated Amorphous Silicon for Flexible Photodetectors

通过调控氢化工艺增强氢化非晶硅中缺陷抑制和电荷传输,从而提高柔性光电探测器的性能

Jeong, Ye-Ji; Hyun, Kyeong-Jin; Jang, Hee-Won; Yun, Jong-Won; Kim, Yong-Hun; Park, Woon Ik; Choi, Soo-Won; Kwon, Jung-Dae

Controlled Formation of Porous Cross-Bar Arrays Using Nano-Transfer Printing

利用纳米转移印刷技术可控形成多孔交叉杆阵列

Kim, Yu Na; Kang, Eun Bin; Park, Tae Wan; Park, Woon Ik

Direct Printing of Ultrathin Block Copolymer Film with Nano-in-Micro Pattern Structures

直接印刷具有纳米微米图案结构的超薄嵌段共聚物薄膜

Park, Tae Wan; Kang, Young Lim; Kang, Eun Bin; Jung, Hyunsung; Lee, Seoung-Ki; Hwang, Geon-Tae; Lee, Jung Woo; Choi, Si-Young; Nahm, Sahn; Kwon, Se-Hun; Kim, Kwang Ho; Park, Woon Ik

High-Resolution Nanotransfer Printing of Porous Crossbar Array Using Patterned Metal Molds by Extreme-Pressure Imprint Lithography

利用极压压印光刻技术,通过图案化金属模具实现多孔横梁阵列的高分辨率纳米转移印刷

Park, Tae Wan; Kang, Young Lim; Kim, Yu Na; Park, Woon Ik

Formation of Multiscale Pattern Structures by Combined Patterning of Nanotransfer Printing and Laser Micromachining

纳米转移印刷与激光微加工相结合形成多尺度图案结构

Park, Tae Wan; Kang, Young Lim; Kang, Eun Bin; Kim, Seungmin; Kim, Yu Na; Park, Woon Ik

Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer

用于稳定冷凝传热的超疏水电沉积铜表面

Park, Junghyun; Kim, Donghyun; Kim, Hyunsik; Park, Woon Ik; Lee, Junghoon; Chung, Wonsub

Controlled self-assembly of block copolymers in printed sub-20 nm cross-bar structures

在印刷的亚20纳米十字形结构中,嵌段共聚物的可控自组装

Park, Tae Wan; Kang, Young Lim; Byun, Myunghwan; Hong, Suck Won; Ahn, Yong-Sik; Lee, Junghoon; Park, Woon Ik

Formation of Li(2)CO(3) Nanostructures for Lithium-Ion Battery Anode Application by Nanotransfer Printing

利用纳米转移印刷技术制备用于锂离子电池负极的Li(2)CO(3)纳米结构

Park, Tae Wan; Kang, Young Lim; Lee, Sang Hyeon; No, Gu Won; Park, Eun-Soo; Park, Chan; Lee, Junghoon; Park, Woon Ik

Thermally assisted nanotransfer printing with sub-20-nm resolution and 8-inch wafer scalability

具有亚20纳米分辨率和8英寸晶圆可扩展性的热辅助纳米转移印刷

Park, Tae Wan; Byun, Myunghwan; Jung, Hyunsung; Lee, Gyu Rac; Park, Jae Hong; Jang, Hyun-Ik; Lee, Jung Woo; Kwon, Se Hun; Hong, Seungbum; Lee, Jong-Heun; Jung, Yeon Sik; Kim, Kwang Ho; Park, Woon Ik