IEEE Transactions on Medical Imaging

期刊全称IEEE Transactions on Medical Imaging
期刊缩写IEEE Trans. Med. Imaging
涉及主题计算机科学人工智能计算机视觉医学物理放射科数学心理学工程类图像(数学)光学生物认知心理学模式识别(心理学)算法统计量子力学机器学习
期刊介绍

IEEE Transactions on Medical Imaging (T-MI) encourages the submission of manuscripts on imaging of body structures, morphology and function, and imaging of microscopic biological entities. The journal publishes original contributions on medical imaging achieved by various modalities, such as ultrasound, X-rays (including CT) magnetic resonance, radionuclides, microwaves, and light, as well as medical image processing and analysis, visualization, pattern recognition, and related methods. Studies involving highly technical perspectives are most welcome. The journal focuses on a unified common ground where instrumentation, systems, components, hardware and software, mathematics and physics contribute to the studies.

期刊ISSNprint: 0278-0062
历年影响因子
2024年 2023年 2022年 2021年 2020年 2019年 2018年 2017年
8.910.611.03710.0486.6857.8166.1313.942
历年发表/被引量
年份20252024202320222021202020192018201720162015201420132012
发表量241401336362356388357336378296282311233257
被引量1568441734463784422747102401233534228105252572217822578223412082919466
h-Index195
自引率5.60%
涉及的研究领域医学-成像科学与照相技术
中科院2025年分区 ?
大类小类TOP期刊综述期刊
1区1区 计算机:跨学科应用
1区工程:生物医学
1区工程:电子与电气
1区成像科学与照相技术
1区核医学
WOS期刊分区

JCR学科分类

JCR分区学科名称收录数据库JCR分区分区排名
COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONSSCIEQ110/175
ENGINEERING, BIOMEDICALSCIEQ110/124
ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ119/366
IMAGING SCIENCE & PHOTOGRAPHIC TECHNOLOGYSCIEQ14/36
RADIOLOGY, NUCLEAR MEDICINE & MEDICAL IMAGINGSCIEQ15/212

JCI学科分类

JCI分区学科名称收录数据库JCI分区分区排名
COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONSSCIEQ18/175
ENGINEERING, BIOMEDICALSCIEQ18/124
ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ114/366
IMAGING SCIENCE & PHOTOGRAPHIC TECHNOLOGYSCIEQ13/36
RADIOLOGY, NUCLEAR MEDICINE & MEDICAL IMAGINGSCIEQ18/212
期刊主页http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=42
投稿网址http://mc.manuscriptcentral.com/tmi-ieee
出版商Institute of Electrical and Electronics Engineers Inc.
出版国家(地区)UNITED STATES
出版语言English
出版周期Monthly
每年出版文章数324
Gold OA文章占比15.79%
原创研究文献占比
(排除综述)
100.00%
SCI收录类型

Science Citation Index Expanded (SCIE)

Scopus (CiteScore)

PubMed链接http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0278-0062%5BISSN%5D
平均审稿周期平均5.4个月
平均录用比例很难
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